Electroplating Thickness Calculator

Inputs

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Choose whether to solve the time required for a target plating thickness or the thickness produced by a planned run time.
Choose a metal preset for density, molar mass and valence, or choose custom bath/metal.
Total area to be plated. Include all parts, sides and surfaces receiving deposit.
ft²
Desired deposited metal thickness.
mil
Cathode current per plated area. Use the process sheet value when available.
A/ft²
Fraction of current that deposits metal instead of hydrogen evolution or side reactions.
%
Available DC current capacity for this rack or bath.
A
Approximate operating voltage used for power and kWh estimates. It does not change the Faraday thickness calculation.
V

Results

Default result
Edit inputs
Plated thickness (t)
0.5 mil
Pass

target thickness

Also computed

Process time (trun) Pass 30.31 min

time required at entered current density

Required current (I) Pass 400 A

surface area x current density

Amp-hours (Ah) Pass 202.1 A*h

current multiplied by plating time

Deposited metal mass (m) 7.415 oz

deposited metal only, before dragout or replenishment allowances

Total charge (Q) 727,500 C

Rectifier utilization (I/Imax) Pass 66.7 %

within entered rectifier capacity

Method notes 3 notes
  • Faraday screen: deposited mass = Q x efficiency x molar mass / (valence x F), and thickness = mass / (density x area).
  • Nickel preset: density 8908 kg/m3, molar mass 0.0586934 kg/mol, valence 2. Verify the actual bath chemistry and valence before production work.
  • This is a process-planning estimate, not a plating procedure. Throwing power, current distribution, shields, anodes, agitation, temperature, bath chemistry, surface preparation, hydrogen embrittlement, stress, masking, dragout and inspection requirements can change the real result.

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