Electroplating Thickness Calculator

Inputs

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Choose whether to solve the time required for a target plating thickness or the thickness produced by a planned run time.
Choose a metal preset for density, molar mass and valence, or choose custom bath/metal.
Total area to be plated. Include all parts, sides and surfaces receiving deposit.
ft²
Desired deposited metal thickness.
mil
Cathode current per plated area. Use the process sheet value when available.
A/ft²
Fraction of current that deposits metal instead of hydrogen evolution or side reactions.
%
Available DC current capacity for this rack or bath.
A
Approximate operating voltage used for power and kWh estimates. It does not change the Faraday thickness calculation.
V

Results

Default result
Edit inputs
Plated thickness(t)
0.5mil
Pass

target thickness

Also computed

Process time(trun)Pass30.31min

time required at entered current density

Required current(I)Pass400A

surface area x current density

Amp-hours(Ah)Pass202.1A*h

current multiplied by plating time

Deposited metal mass(m)7.415oz

deposited metal only, before dragout or replenishment allowances

Total charge(Q)727,500C

Rectifier utilization(I/Imax)Pass66.7%

within entered rectifier capacity

Method notes 3 notes
  • Faraday screen: deposited mass = Q x efficiency x molar mass / (valence x F), and thickness = mass / (density x area).
  • Nickel preset: density 8908 kg/m3, molar mass 0.0586934 kg/mol, valence 2. Verify the actual bath chemistry and valence before production work.
  • This is a process-planning estimate, not a plating procedure. Throwing power, current distribution, shields, anodes, agitation, temperature, bath chemistry, surface preparation, hydrogen embrittlement, stress, masking, dragout and inspection requirements can change the real result.

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